New Contract Win & Completed Tape-out of ASIC

(AIM:ENSI) EnSilica plc has announced the signing of a new ASIC development and supply contract with a US healthcare technology company, valued at approximately US$2.4 million in development revenues. This agreement follows the successful conversion of an initial feasibility study that began earlier in the year. The programme involves the development of a wireless biosensing and therapeutic controller ASIC, intended for use in treating a prevalent chronic condition affecting tens of millions in the United States and hundreds of millions globally. The development programme is expected to span 18 months, and the agreement includes a framework for EnSilica to supply the ASIC over the product's commercial lifetime, representing a potentially significant recurring revenue opportunity. EnSilica has also completed the tape-out of a next-generation ASIC for a UK publicly quoted life-sciences technology company, marking a key milestone under a previously announced contract valued at approximately US$1.6 million. This life-sciences contract covers design implementation, tape-out management, and prototype wafer manufacturing services for a chip used in advanced life-science analysis systems. With tape-out complete, the design is now progressing to fabrication at a leading foundry, and EnSilica will continue to support the customer through wafer manufacturing and into production. The majority of revenue from the life-sciences contract is expected to be recognised in the financial year ending 31 May 2027, with the potential for additional long-term revenue from future production wafer supply. Both programmes were initially announced by EnSilica on 10 March 2026 and have now reached significant milestones. Ian Lankshear, Chief Executive Officer of EnSilica, stated that converting the feasibility study into a multi-year development and supply agreement demonstrates the scale of the market opportunity and the potential for significant chip volumes as the product moves towards commercialisation. He also highlighted the importance of completing the tape-out for the UK life-sciences ASIC as evidence of the team's ability to execute complex design and manufacturing programmes. EnSilica operates design centres in the United Kingdom, India, Brazil, Hungary, and Italy.

EU Space & Comms Centre of Excellence

(AIM: ENSI) EnSilica plc announced it will be opening a new Space & Communications Semiconductor Centre of Excellence in Milan, Italy. The centre will initially recruit 20 specialist modem and mmWave engineers over the next six months, expanding EnSilica's engineering presence within the European Union. This Milan centre will be EnSilica's third site in Europe, joining its design centre in Budapest, Hungary, and sales centre in Munich, Germany. The centre will provide EU-based expertise in modem architecture, physical-layer algorithms, digital signal processing, and mmWave communications systems, working alongside EnSilica's established ASIC engineering and operations teams. Milan was selected for its established semiconductor, communications, and space technology ecosystem, and Northern Italy hosts one of Europe's largest clusters of semiconductor and communications engineering companies. Italy is described as a significant European semiconductor nation and among the largest national contributors to the European space sector. The location will give EnSilica access to specialist engineering talent, proximity to customers and partners across the European supply chain, and a platform for collaborative research and EU-funded development. The centre will support EnSilica's growing portfolio of customer-funded ASIC programmes and its own ASSP developments. This initiative forms part of the Group's strategy to become the leading European provider of application-specific silicon for space and satellite communications. Ian Lankshear, Chief Executive Officer of EnSilica plc, stated that recruiting 20 modem and mmWave engineers over the next six months will give the company specialist capability at both the systems and semiconductor level to support the existing pipeline.

Follow on Satellite Orders

(AIM: ENSI) EnSilica plc announced follow-on chip orders worth €1.1 million from a European satellite communications customer for its ENS92040 distributed digital beamformer ASSP. The €1.1 million order comprises €350,000 for additional samples and €750,000 to contribute towards product enhancements. In February 2023, EnSilica announced funding of €5 million from the European Space Agency ('ESA') to develop the ENS92040 chip. In August 2023, EnSilica announced a €2.5 million order from the same customer for ENS92040, including an initial order for 50,000 of the ASSP. The satellite communications user terminal market has a Serviceable Addressable Market which is expected to grow by 5x, up from $650m in 2025 during initial deployment and growing to over $3bn alongside mass adoption in 2030. Supply revenue is expected to grow significantly from 2029, as this new generation of satellite constellations enter service. The ENS92040 is also one of the ASSPs identified for further investment as part of the Company's recently announced equity fundraising.

Ensilica — Result of Retail Offer and Notice of GM

(AIM: ENSI) EnSilica plc has conditionally raised a total of approximately £14.9 million pursuant to the Placing, Subscription and the Retail Offer. On 7 July 2026, the company announced it had conditionally raised gross proceeds of approximately £14 million at the Issue Price of 91 pence per share through the Placing of 15,381,315 Placing Shares and the Subscription for 3,300 Subscription Shares. The Retail Offer, which closed at 12.00 p.m. on 9 July 2026, conditionally raised approximately £0.9 million (before expenses) through the issuance of 973,569 Retail Offer Shares at the Issue Price. Application has been made to the London Stock Exchange plc for 4,570,461 new Ordinary Shares to be admitted to trading on AIM, with dealings expected to commence at 8.00 a.m. on 29 July 2026, subject to the passing of Resolutions at the General Meeting on 27 July 2026. The Company will post a Circular to Shareholders on 10 July 2026 containing details of the Fundraising and the notice of General Meeting. The Retail Offer was open to new retail investors in the United Kingdom as well as existing shareholders. The person responsible for arranging for the release of this Announcement on behalf of EnSilica is Ian Lankshear, Chief Executive Officer.

Ensilica — Retail Offer to raise up to £1 million

(AIM: ENSI) EnSilica plc announced a retail offer to raise up to £1 million through the issue of up to 1,098,901 new Ordinary Shares at an issue price of 91 pence per share. The company has also conditionally raised gross proceeds of approximately £14 million through a placing and subscription of new Ordinary Shares at the same issue price. The first tranche of the placing, approximately £10.73 million, is expected to complete on or around 10 July 2026, and the second tranche and subscription, approximately £3.27 million, is expected to complete on or around 29 July 2026. The retail offer opens on 7 July 2026 at 7:05 AM and is expected to close at 12:00 PM on 9 July 2026, with results announced by 10 July 2026 and admission to trading on AIM expected on or around 29 July 2026. The minimum subscription per investor is £100.00, and there is no maximum application amount except that the aggregate total consideration for the Retail Offer shall not exceed £1 million. The issue of the Retail Offer Shares is conditional upon the passing of resolutions at a General Meeting expected to be held at 10.00 a.m. on 27 July 2026 at Fieldfisher LLP, Riverbank House, 2 Swan Lane, London, EC4R 3TT. The company projects that, conditional upon the passing of the resolutions, the Retail Offer Shares will be admitted to trading on AIM at 8.00 a.m. on or around 29 July 2026.

Edge AI ASIC Supply Contract Completes Tape-Out

(AIM: ENSI) EnSilica plc announced the successful completion of production tape-out for its Edge AI ASIC supply contract, releasing the US$5m NRE and tape-out fee to be recognised across FY2026 and FY2027. The customer forecast indicates this chip will become one of the largest revenue generating contracts in EnSilica's portfolio, with the Edge-AI supply contract expected to contribute up to an estimated US$50 million over five years once full-scale production commences. First silicon samples are anticipated in 2026 and volume production is expected to begin during calendar year 2027. Three additional ASICs are now expected to join the five ASICs currently in volume production over the next 18 months, and a further eleven active ASIC and ASSP programmes continue to progress through their respective design and development phases. The company serves the Space & Comms, Industrial, Automotive and Healthcare markets and operates design centres across the UK, India, Brazil and Hungary. The announcement states that the expanding portfolio reflects the strengthening of both EnSilica's recurring semiconductor supply revenues and its long-term growth prospects. Management targets full-scale production of the first chip within the significant growth market of Edge AI processing.